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昂科烧录器软件_ V1.05.21(20230304)今日发布

时间:2023-03-05   访问量:2713

Hi  All:

 

昂科软件_ V1.05.21(20230304)今日发布,如有需要,请前往官网下载,链接:

下载链接(先注册-登录-再到软件下载中心-下载)https://www.acroview.com/member/login/

 

A:手动烧录器:AP8000、AP8000F、PT100

B:ic自动烧录机:IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200

更新芯片列表如下:


更新芯片列表如下:

                                                            V1.05.21_20230304
AcroviewProgrammer TypeItemsManufactureChip NamePackageAdapterDescription
New DevicesActionsATS2853(SPC1)QFN48(6x6)QFN48(6x6)-AG84
AdestoAT25SF641-S*BSO8(210mil)SO8(210)-AG01
AllegroA5931GESTR-TQFN24(4x4)QFN24(4x4)-AG03
AllegroA5932GESSR-1-TQFN24(4x4)QFN24(4x4)-AG06
AllegroA5932GESSR-TQFN24(4x4)QFN24(4x4)-AG06
AnalogixANX7411QFN28(4x4)QFN28(4x4)-AG20
BOSCHSMA750(ISP-PSI5)NULLISP(SPC)-S19
CypressCY91F526JSE-GSE2LQFP120(16x16)TQFP120(16x16)-AG10
EastsoftHR7P170FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHS3SO16(150)SO16(150)-AG12
GigaDeviceGD32FFPRTGUQFN36(6x6)QFN36(6x6)-AG01
GigaDeviceGD25LD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25LD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25WD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25WD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25WD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25LF80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LF80ENUSON8(3x4mm)DFN8(3x4)-AG01
GigaDeviceGD25LF80ESSOP8(208mil)SO8(210)-AG01
GigaDeviceGD32E503RCTTQFP64(10x10)TQFP64(10x10)-AG01(F)
HisiliconSD5006RNIV100(P+D)QFN40(6x6)QFN40(6x6)-S03
HisiliconSD5006RNIV101(P+D)QFN48(7x7)QFN48(7x7)-S42
HisiliconSD5006RNIV101-ICBoard(P+D)QFN42(17x20)QFN42(17x20)-S01
HisiliconSD5006RQIV103(P+D)TQFP64(10x10)TQFP64(10x10)-S43
HisiliconSD5006RQIV103-ICBoard(P+D)QFN54(20x22)QFN54(20x22)-S01
HYCONHY16F198B-L064LQFP64(10x10)TQFP64(7x7)-AG118
INDIEIND83211QFN48(6x6)QFN48(6x6)-AG76
ITEIT8857FNQFN56(6x6)QFN56(6x6)-AG09
MicrochipPIC16F1823-*/MLQFN16(4x4)QFN16(4x4)-AG01
MicrochipPIC16F1829-*/MLQFN20(4x4)QFN20(4x4)-AG01
MPSMAC1678GQNTQFN56(7x7)QFN56(7x7)-AG35
MTMicrosystemsMT6AGCS(TEST029)QFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01(CS)
NXPSPC5606BF1*LQTQFP144(20x20)TQFP144(20x20)-AG10
NXPFXLS93230(ISP-PSI5)NULLISP(SPC)-S19
NXPNCF29A3XHNQFN32(5x5)QFN32(5x5)-S32
NXPS9S08DZ96F2*LHTQFP64(10x10)TQFP64(10x10)-AG08
RenesasR7FA2E1A7*CFLTQFP48(7x7)TQFP48(7x7)-AG149
RICHTEKRT7807N-AQFN32(4x4)QFN32(4x4)-AG68
SanDiskSDINBDA6-256GBGA153(11.5x13)BGA153(11.5x13)-AG01
STMT6AGCS(TEST029)-STQFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
STSTM32WB55*G(FUS+BLEStack+APP+Option)(ISP-SWD-3V-SPC0022)NULLISP-AG08
STSTM32F103VGTLQFP100(14x14)TQFP100(14x14)-AG07(F)(CS)
TIBQ27500QFN12(4x2.5)QFN12(4x2.5)-AG02
TITPS536C7(HEX)QFN48(6x6)QFN48(6x6)-AG46
TITMS320F28035(ISP-JTAG-3.3VTTL-3.3V)NULLJTAG(C2000)-S01
ToshibaTHGBMJG6C1LBAU7BGA153(11.5x13)BGA153(11.5x13)-AG01
YMTCYMEC7BOTE1A2C3BGA153(11.5x13)BGA153(11.5x13)-AG01
Update DevicescFeonEN25QH16B-***HSOP8(200mil)SO8(210)-AG01Update: After burning CMP, there is no way to re-burn the flash area

(Must carefully confirm config option and redo project load burning)
CypressCYPD5225-96BZXBGA96(6x6)BGA96(6x6)-S02Update: Solve the problem that some chips fail to enter mode and the data is changed after burning customer files

(Must carefully confirm config option and redo project load burning)
elmosE52417A(SPC)QFN20(5x5)QFN20(5x5)-AG04Update: To solve the problem of burning CC address data is not correct, add Secure Verify

(Must carefully confirm config option and redo project load burning)
GigaDeviceGD32F470ZGTTQFP144(20x20)TQFP144(20x20)-AG06Update: Fix stability issues and speed up

(Must carefully confirm config option and redo project load burning)
iCommSemiSV32WB01LQFN32(4x4)QFN32(4x4)-AG43Update: Solve the problem of CHECKSUM failure when customers burn SV32WB01L chip files larger than 1M

(Must carefully confirm config option and redo project load burning)
KIOXIATC58CYG1S3HRAIJWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed number of blocks and buffer range

(Must carefully confirm config option and redo project load burning)
MicrochipdsPIC33CK256MP503(SINGLE)QFN36(5x5)QFN36(5x5)-AG01Update: Solve some chip burning failure problem

(Must carefully confirm config option and redo project load burning)
MicrochipATSAME51J18A-ATQFP64(10x10)TQFP64(10x10)-AG80Update: Solve the Reserved bit does not burn no check problem

(Must carefully confirm config option and redo project load burning)
MPSMP2845BGQKQFN56(6x6)QFN56(6x6)-AG08What's New: Modified the Check ID flow and password processing flow

(Must carefully confirm config option and redo project load burning)
NationN32G435CBLTQFP48(7x7)TQFP48(7x7)-AG73Update: Resolve erasing failure and report check failure when burning

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8200A0ESQFN56(8x8)QFN56(8x8)-AG06Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8100A0ESQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC34PF8100A0EPQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPS32K314EHT1*PBMAXQFP172(16x16)MAXQFP172(16x16)-AG01Update: Solve the problem of checking failure when burning

(Must carefully confirm config option and redo project load burning)
RealtekRTL8762DKQFN48(6x6)QFN48(6x6)-S28Update: Solve the problem of unstable burning

(Must carefully confirm config option and redo project load burning)
RenesasR7F701649*AFPPQFP176(24x24)PQFP176(24x24)-4-AG29Update: Customer part of the material erasure failed

(Must carefully confirm config option and redo project load burning)
RenesasR7F701374A*AFPLQFP144TQFP144(16x16)-AG02New: Added functions of Code ID and Data ID

(Must carefully confirm config option and redo project load burning)
WinbondW25N01GWZEIGWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed multiple seat son erasing bad block failure

(Must carefully confirm config option and redo project load burning)
WinbondW25Q128JVSIMSOIC8(208mil)SO8(210)-AG01New: Changed the default QE value

(Must carefully confirm config option and redo project load burning)
GUI modifcationsV1.4.11(20230220) 1、取消”Intel Hex”限制,可以对所有档案解析负偏移
Firmware modifications
MultiAprog modificationsV1.2.99(20230223) 1、多站点初始化由串行改成并行,加快启动速度     2、新增对Bottom Board-AG07的支持


------------------Best wishes--------------------



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