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尊敬的昂科烧录器用户:
您好,十分荣幸和您一起交流学习IC芯片烧录技术与知识分享。现在为您更新AP8000烧录软件临时版本V1_06_08t4(20260708)
下载链接(先注册-登录-再到软件下载中心-下载)https://www.acroview.com/member/login/
昂科自主研发的烧录核心AP8000可支持的芯片种类有Nor Flash/Nand flash、eMMC、UFS、 EEPROM、 EPROM、MCU、CPLD、 CMOS PLD.
包括TSOP, BGA, QFP, TSSOP, FBGA, TQFP, CSP, uBGA, PLCC, SOP, PoP, SSOP, TFBGA,WLCSP等多种封装。
其中烧录器软件适用机型:
烧录器:AP8000、AP8000F、PT100
自动烧录机:IPS5800S、IPS5200S、PH-A2000+、IPS-MINI PRO、PH-A2000、IPS3000S、EAP5000;
更新芯片列表如下:
| V1_06_08t4(20260708) | |||
| IC厂商 | IC型号 | IC封装 | 适配座型号 |
| AdvanceChip | ADP32F035BQP64 | TQFP64(10x10) | TQFP64(10x10)-AG02 |
| Airoha | AB1585M | BGA110(4.2x5.5) | BGA110(4.2x5.5)-AG01 |
| Altera | BGA4700(56x66)-S01 | BGA4700(56x66)d | |
| Cypress | CY8C4024AZI-S413 | TQFP48(7x7) | TQFP48(7x7)-AG04 |
| Dosilicon | DSND8G08S3I-*D | BGA63(9x11mm) | BGA63(9x11)-AG01 |
| ESMT | F50D2G41KB | WSON8(8x6mm) | VPDFN8(8x6)-AG01 |
| ESMT | F50L2G41KB | WSON8(8x6mm) | VPDFN8(8x6)-AG01 |
| ESMT | F50D1G41LC | WSON8(8x6mm) | VPDFN8(8x6)-AG01 |
| Explore | EP9511T | TQFP64(7x7) | TQFP64(7x7)-S23 |
| FORESEE | FSNS8B004G-B(G00610) | FBGA-63(9x11mm) | BGA63(9x11)-AG01 |
| Fortior Tech | FU6881Q1 | QFN40(5x5) | QFN40(5x5)-AG183 |
| Gigadevice | GD32F103RBT | TQFP64(10x10) | TQFP64(10x10)-AG01(F) |
| Gigadevice | GD32F103RCT | TQFP64(10x10) | TQFP64(10x10)-AG01(F) |
| GigaDevice | GD32G533RCH | BGA64(5x5) | BGA64(5x5)-AG07 |
| GigaDevice | GD25LQ64ES2GR(DJI) | SOP8(208mil) | SO8(210)-AG01 |
| GSTO | GSS04GPBXO-F6EGIO | BGA63(9x11) | BGA63(9x11)-AG01 |
| HiTrendtech | HT6033 | LQFP100(14x14) | TQFP100(14x14)-AG73 |
| HoSinGlobal | HAD16-04G0BSFC | BGA153(9x7.5) | BGA153(9x7.5)-AG01 |
| HuYang | P724S(ISP-JTAG-3.3VTTL-3.3V) | NULL | ISP(DAP)-AG01 |
| HuYang | P724S | BGA724(22.6x22.6) | BGA724(22.6x22.6)-S01 |
| Hynetek | HUSB362(ChipID:0x2E992510) | QFN24(4x4) | QFN24(4x4)-AG60 |
| Infineon | XDPS2201E(APARAM) | PG-DSO-14 | SO16(150)-AG04 |
| ITE | IT82202E-512/AW | TQFP128(14x14) | TQFP128(14x14)-AG33 |
| Kingston | E01GM75AXI-03005 | BGA153(11.5x13) | BGA153(11.5x13)-AG01 |
| Microchip | PIC16F505-*/SL | SO14(150) | SO14(150)-AG01 |
| Microchip | PIC16C73B-04*/SO | SO28(300) | SO28(300)-AG37 |
| MPS | MPQ2967GQKTE(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN40(6x6)-AG01 | ISP-HighTemp-JPBoard |
| MPS | MPQ8874GVE(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN22(4x5)-AG01(CS) | ISP-HighTemp-JPBoard |
| MPS | MP29452GQNT(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN56(7x7)-AG01(CS) | ISP-HighTemp-JPBoard |
| MPS | MP2965CGMK(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN48(6x6)-AG01 | ISP-HighTemp-JPBoard |
| MPS | MP2763(ISP-HighTemp-TEST045) | ISP-HT-LoadBoard-QFN30(4x5)-AG01 | ISP-HighTemp-JPBoard |
| NXP | LPC1225FBD48/301 | TQFP48(7x7) | TQFP48(7x7)-AG328 |
| NXP | S32K314NHT1*MM(AB Swap HSE) | BGA257(14x14) | BGA257(14x14)-AG02 |
| Phison | PTE4A0TN-64GE | BGA153(11.5x13) | BGA153(11.5x13)-AG01 |
| Realtek | MHCB12S | QFN28(13.5x12) | QFN28(13.5x12)-AG01 |
| Renesas | R5F10DMG*FB | PQFP80(12x12) | PQFP80(12x12)-AG101 |
| Renesas | RAA228249A | QFN56(7x7) | QFN56(7x7)-AG31 |
| Renesas | RAA228249B | QFN56(7x7) | QFN56(7x7)-AG31 |
| Renesas | RAA228249C | QFN56(7x7) | QFN56(7x7)-AG31 |
| Renesas | RAA228249 | QFN56(7x7) | QFN56(7x7)-AG31 |
| ScioSense | TDC-GP30YA-F01(SPC0125) | QFN40(6x6) | QFN40(6x6)-AG162 |
| Silergy | SAH32B20XAQ(SPC0123) | QFN56(8x8) | QFN56(8x8)-AG22 |
| Spansion | S25FL256SAGMFV00 | SO16(300) | SO16(300)-AG01 |
| ST | STA8089FG | QFN56(7x7) | QFN56(7x7)-AG53 |
| ST | STM32H563RIT | TQFP64(10x10) | TQFP64(10x10)-AG01(F) |
| ST | STM32U585VIT*Q(SECURE) | LQFP100(14x14) | TQFP100(14x14)-AG213 |
| ST | STM32L051C6T6TR | BGA4700(56x66) | BGA4700(56x66)-S01 |
| TI | TMS320F2800157*RHB | QFN32(5x5) | QFN32(5x5)-AG182(A) |
| TI | TMS320F28035PAG | TQFP64(10x10) | TQFP64(10x10)-AG02 |
| UNIM | UM19A0H**W | WSON8(8x6mm) | VPDFN8(8x6)-AG01 |
| Winbond | W25Q12RVCF*Q | SOP16(300mil) | SO16(300)-AG01 |
| Winbond | W25Q128JVS*Q | SOIC8(208mil) | SO8(210)-AG01 |
| Winbond | W25Q16JVSS*Q(Flash) | SOIC8(208mil) | SO8(210)-AG01 |
| XinCun | XCSP1AAPK-ITK-M | WSON8(8x6mm) | VPDFN8(8x6)-AG01 |
昂科技术简介
昂科技术成立于2013年2月,2016年被认定为国家高新企业和深圳市高新企业,并取得多项软件著作权以及专利,昂科核心人员均拥有编程设备研发、制造以及服务领域十多年的丰富经验,具有世界领先技术,并致力于为客户提供创新的芯片烧录器解决方案和产品。正努力为编程设备的可靠性、安全性以及知识产权保护方面做出杰出贡献。昂科始终坚信对品质与技术的追求会使越来越多的电子厂商选择昂科作为他们值得信赖的合作伙伴,新产品持续在发布中,请保持关注。
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